3w 10w Low power Sport Light Par Light LM80 passed COB led
• Efficacy of 128 lm/W typical for 3000K, 80CRI
• Compact high flux density light source
• Uniform, high quality illumination
• Minimum 70, 80, and 90 CRI options
• StreaCLined thermal path
• ENERGY STAR® / ANSI compliant color binning
structure with 2, 3 and 5 SDCM standard
• More energy efficient than incandescent, halogen
and fluorescent lamps
• High voltage or Low voltage DC operation
• Product series and company logo on the front
• RoHS compliant
The part number designation for TYF ML Series LED arrays is explained as follows:
3, Maximum Ratings
| Part Number | Typical Power (W) | Nominal CCT (K) | Minimum Pulsed Flux (lm) | Typical Pulsed Flux (lm) | Typical Voltage (V) | Nominal Current (mA) | Typical Efficacy (lm/W) |
| ML13070302P530E*7 | 3.1 | 3000 K | 377 | 419 | 9.6 | 320 | 135 |
| ML13070302P535E*7 | 3.1 | 3500 K | 382 | 425 | 9.6 | 320 | 137 |
| ML13070302P540E*7 | 3.1 | 4000 K | 385 | 428 | 9.6 | 320 | 138 |
| ML13070302P550E*7 | 3.1 | 5000 K | 388 | 431 | 9.6 | 320 | 139 |
| ML13070302P557E*7 | 3.1 | 5700 K | 391 | 434 | 9.6 | 320 | 140 |
| ML13070302P565E*7 | 3.1 | 6500 K | 388 | 431 | 9.6 | 320 | 139 |
| ML13070302P522E*8 | 3.1 | 2200 K | 304 | 338 | 9.6 | 320 | 109 |
| ML13070302P527E*8 | 3.1 | 2700 K | 326 | 363 | 9.6 | 320 | 117 |
| ML13070302P530E*8 | 3.1 | 3000 K | 338 | 375 | 9.6 | 320 | 121 |
| ML13070302P535E*8 | 3.1 | 3500 K | 346 | 384 | 9.6 | 320 | 124 |
| ML13070302P540E*8 | 3.1 | 4000 K | 352 | 391 | 9.6 | 320 | 126 |
| ML13070302P550E*8 | 3.1 | 5000 K | 357 | 397 | 9.6 | 320 | 128 |
| ML13070302P557E*8 | 3.1 | 5700 K | 363 | 403 | 9.6 | 320 | 130 |
| ML13070302P565E*8 | 3.1 | 6500 K | 357 | 397 | 9.6 | 320 | 128 |
| ML13070302P522E*9 | 3.1 | 2200 K | 262 | 291 | 9.6 | 320 | 94 |
| ML13070302P527E*9 | 3.1 | 2700 K | 285 | 316 | 9.6 | 320 | 102 |
| ML13070302P530E*9 | 3.1 | 3000 K | 296 | 329 | 9.6 | 320 | 106 |
| ML13070302P535E*9 | 3.1 | 3500 K | 304 | 338 | 9.6 | 320 | 109 |
| ML13070302P540E*9 | 3.1 | 4000 K | 310 | 344 | 9.6 | 320 | 111 |
| ML13070302P550E*9 | 3.1 | 5000 K | 315 | 350 | 9.6 | 320 | 113 |
| ML13070302P557E*9 | 3.1 | 5700 K | 321 | 357 | 9.6 | 320 | 115 |
5.1 Color Binning Information
Figure 1: Graph of Test Bins in xy Color Space (Pulsed Test Conditions, Tj = 25°C)
CIE1931-x
Table 38: 2-Step to 5-step MacAdam ellipse color bin definitions for TYF CoB Core Range
| Nominal CCT | Center Point | MAJOR AXIS (a , b) | Ellipse Rotation Angel,θ |
| X | Y | 2-Step | 3-Step | 5-Step |
| 2200K | 0.5018 | 0.4153 | (0.0048 , 0.0027) | (0.0072, 0.0041) | (0.0120, 0.0067) | 39.9 |
| 2500K | 0.4806 | 0.4141 | (0.0050, 0.0027) | (0.0076, 0.0041) | (0.0126, 0.0068) | 53.1 |
| 2700K | 0.4575 | 0.4101 | (0.0053, 0.0027) | (0.0080, 0.0041) | (0.0133, 0.0068) | 54.1 |
| 3000K | 0.4338 | 0.4030 | (0.0057, 0.0028) | (0.0086, 0.0042) | (0.0142, 0.0069) | 53.7 |
| 3500K | 0.4073 | 0.3917 | (0.0062, 0.0028) | (0.0093, 0.0041) | (0.0155, 0.0069) | 54.0 |
| 4000K | 0.3818 | 0.3797 | (0.0063, 0.0027) | (0.0093, 0.0042) | (0.0157, 0.0068) | 53.4 |
| 5000K | 0.3447 | 0.3553 | (0.0054, 0.0024) | (0.0081, 0.0035) | (0.0135, 0.0059) | 59.8 |
| 5700K | 0.3290 | 0.3417 | (0.0048, 0.0021) | (0.0072, 0.0032) | (0.0119, 0.0052) | 58.8 |
| 6500K | 0.3123 | 0.3282 | (0.0044, 0.0018) | (0.0066, 0.0027) | (0.0110, 0.0045) | 58.1 |
6.1 Table 39: Maximum Ratings
Notes for Table 39:
- Driven the arrays at higher currents however lumen maintenance may be reduced.
- Proper current derating must be observed to maintain junction temperature below the maximum
- Pulsed operation with a peak drive current equal to the stated peak pulsed forward current is acceptable if the pulse on-time is ≤1ms per cycle and the duty cycle is ≤10%
- Light emitting diodes are not designed to be driven in reverse voltage and will not produce light under this condition. Maximum rating provided for reference only.
Notes: 1. All dimension tolerance is ±0.2mm unless otherwise noted. 2. Tc measurement point at cathode
RECOMMENDED SOLDERING CONDITION
For manual soldering. Please use lead-free soldering and the soldering shall be implemented using a soldering bit at a
temperature lower than 350C, and shall be finished within 3.5 seconds for one land. No external force shall be applied
to resin part while soldering is implemented. Next process of soldering should be carried out after the product has
return to ambient temperature. CAUTION: TEMPERATURE CONTROL
Product Packing and Labeling
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3w 10w Low Power Sport Light Chip Led Cob Flexible Application Long Lifespan Images
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